application
This product can be applied to truncate large, irregularly-shaped, hard and brittle materials
such as silicon crystal, quartz, ceramics, sapphire, glass, gallium arsenide, and so on
process instructions
application
This product can be applied to hard and brittle materials such as sapphire, silicon carbide (SiC), gallium nitride (GaN), etc.
process instructions
Patent Registration in Taiwan/China/Japan/Korea
application
Specially developed for cutting 4 to 8 inch wafers of brittle and hard materials such asWide Band Gap Semiconductors and ceramics, this equipment provides excellent cutting edges and efficient grain cutting.
process instructions
