Micron Diamond Wire & Equipment Co., Ltd. (MDWEC) is a subsidiary of WEC Group, which was established in 2007. The talented employees and managing business with heart are our essential conceptual framework. We aggressively keep Researching & Developing with up-to-date vision. Through strategic-partnership with customers, we constantly develop new product applications and master the market demand in order to keep investing to create supplementary value for existing products to meet our customer's needs. All these efforts continue to keep us competitive and predominant in the market.

MDWEC has more than 20 years of experience in Diamond Tools Manufacture. We specialize in developing unique coating technology, production, total solution and marketing for Diamond Coating Wire and Wire Saws equipments.

Our products are mainly applied to the fields of PV, semiconductors, LED, photoelectric, communications, glass, display, hard and brittle materials, etc. The major processes are squaring, slicing, sawing and cutting.....

Our products are also available in slicing various hard and brittle materials, including Stones, Quartz, Glass, Semiconductor Wafer (LiTaO3, LiNBO3, Li2B4O3, Sapphire, ZnO, GaAs, ALN, InAs, etc), mono/poly silicon, ceramic, and other advanced materials with single and multiple wire blade sawing.